Description
9/8th Generation Intel Core Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 2x PCI/PCIe Expansion Slots
SPECIFICATION
Model Name | DS-1200 | DS-1201 | DS-1202 | |
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System | Processor | • 9th Generation Intel® Coffee Lake-R S Series CPU: - Intel® Core™ i7-9700E 8 Cores Up to 4.4 GHz, TDP 65W - Intel® Core™ i5-9500E 6 Cores Up to 4.2 GHz, TDP 65W - Intel® Core™ i3-9100E 4 Cores Up to 3.7 GHz, TDP 65W - Intel® Core™ i7-9700TE 8 Cores Up to 3.8 GHz, TDP 35W - Intel® Core™ i5-9500TE 6 Cores Up to 3.6 GHz, TDP 35W - Intel® Core™ i3-9100TE 4 Cores Up to 3.2 GHz, TDP 35W • 8th Generation Intel® Coffee Lake S Series CPU: - Intel® Core™ i7-8700 6 Cores Up to 4.6 GHz - 12M Cache, TDP 65W - Intel® Core™ i5-8500 6 Cores Up to 4.1 GHz - 9M Cache, TDP 65W - Intel® Core™ i3-8100 4 Cores 3.6 GHz - 6M Cache, TDP 65W - Intel® Core™ i7-8700T 6 Cores Up to 4.0 GHz - 12M Cache, TDP 35W - Intel® Core™ i5-8500T 6 Cores Up to 3.5 GHz - 9M Cache, TDP 35W - Intel® Core™ i3-8100T 4 Cores 3.1 GHz - 6M Cache, TDP 35W - Intel® Pentium® G5400 2 Cores 3.7 GHz - 4M Cache, TDP 58W - Intel® Pentium® G5400T 2 Cores 3.1 GHz - 4M Cache, TDP 35W - Intel® Celeron® G4900 2 Cores 3.1 GHz - 2M Cache, TDP 54W - Intel® Celeron® G4900T 2 Cores 2.9 GHz - 2M Cache, TDP 35W |
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Chipset | Intel Q370 | |||
BIOS | AMI 32MB SPI BIOS | |||
Memory | • 2x DDR4 2400/2666 MHz SO-DIMM Sockets • Supports Un-buffered and Non-ECC Type Up to 64 GB |
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Graphics | Graphics Engine | Integrated Intel® UHD Graphics 630: Core™ i7/i5/i3 Integrated Intel® UHD Graphics 610: Pentium® /Celeron® Supports Triple Independent Display (1x DVI-I, 2x DisplayPort) |
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Audio | Audio Codec | Realtek® ALC888 High Definition Audio |
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I/O Interface | Connector | •1x DVI-I (DVI-D: 1920 x 1200 @60Hz / VGA: 1920 x 1080 @60Hz) | ||
DisplayPort | •2x DisplayPort Connector (4096 x 2304 @ 60Hz, According to CPU Specifications)
* Verified maximum resolution: 3840x2160. |
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LAN | •2x GbE LAN (Supports WoL, Teaming, Jumbo Frame & PXE), RJ45 -GbE1: Intel® I210 -GbE2: Intel® I219-LM | |||
COM | •2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 | |||
USB | •2x USB 3.2 Gen2 (TypeA) •4x USB 3.2 Gen1 (TypeA) •2x USB 2.0 (Type A) | |||
mini-DIN | •1x PS/2, 6-pin mini-DIN Female Connector | |||
Mic-in | •1x Line-out & 1x Mic-in, Phone Jack 3.5mm | |||
Power On/Off Switch Button | •1x ATX Power On/Off Switch | |||
Mode Switch | •1x AT/ATX Mode Switch | |||
CMOS Switch | •1x Clear CMOS Switch | |||
Remote Power On/Off Connector | •1x Remote Power On/Off Connector, 2-Pin Terminal Block | |||
Terminal Block | •1x Remote Reset Connector, 2-pin Terminal Block •1x External Fan Connector, 4-Pin Terminal Block (Supports smart fan function) | |||
Storage | SSD/HDD | • 2x 2.5" SATA HDD/SSD bay (Gen3), 1x Internal, 1x Front Accessable • Supports RAID 0/1 |
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mSATA | 3x mSATA (shared by Mini-PCIe socket) (Gen3), BIOS Selectable | |||
M.2 | 1x M.2 Key M 2280 Socket, Supports PCIe x4 NVMe SSD or SATA SSD (Gen3) | |||
Expansion | Mini PCIe | 3x Full-size Mini-PCIe Socket | ||
SIM Socket | 2x SIM Socket | |||
CFM (Control Function Module) Interface | 1x CFM (Control Function Module) Interface | |||
CMI (Combine Multiple I/O) Interface | 2x CMI (Combined Multiple I/O) High Speed Interface ​2x CMI (Combined Multiple I/O) Low Speed Interface |
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Antenna | 2x Antenna Holes | |||
PCI/ PCIe Expansion | 1x PCI/PCIe Expansion slot (with Optional Riser Card) * Supports maximum dimensions of add-on card (H x L) : 111 x 235 mm |
2x PCI/PCIe Expansion slot (with Optional Riser Card) * Supports maximum dimensions of add-on card (H x L) : 111 x 235 mm |
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Other Function | Instant Reboot | Support Instant Reboot Technology (0.2 sec) | ||
CMOS | SuperCap Integrated for CMOS Battery Maintenance-free Operation | |||
Watchdog Timer | Software Programmable Supports 256 Levels System Reset | |||
Power Requirement | Power Type | •AT / ATX | ||
Power Supply Voltage | •9~48VDC | |||
Terminal | •1x 3-Pin Terminal Block | |||
Power Adapter | •Power Adapter AC/DC 24V/5A 120W or 24V/9.2A 220W (Optional) | |||
Physical | Dimension ( W x D x H ) | •227 x 261 x 88 mm | •227 x 261 x 108 mm | •227 x 261 x 128 mm |
Weight | •4.3 kg | •4.92 kg | •5.14 kg | |
Construction | •Extruded Aluminum with Heavy Duty Metal | |||
Mounting | •Wall Mounting | |||
Physical Design | •Unibody Design •Fanless Design •Jumper-less Design | |||
Protection | Reverse Power Input Protection | Yes | ||
Over Voltage Protection | Protection Range: 51~58V Protection Type: shut down operating voltage, re-power on at the preset level to recover |
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Over Current Protection | 15A | |||
Operating System | Windows | Windows® 10 | ||
Linux | Supports by project | |||
Environment | Operating Temperature | • 35W TDP Processor: -40°C to 70°C • 51~65W TDP Processor: -40°C to 45°C * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
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Storage Temperature | -40°C to 85°C | |||
Relative Humidity | 95%RH @ 70°C (non-Condensing) | |||
Shock | Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) | |||
Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64) | |||
MTBF | 396,565 Hours | |||
EMC | • CE, UKCA, FCC, ICES-003 Class A • EN 50155 (EN 50121-3-2 Only) |
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EMI | • CISPR 32 Conducted & Radiated: Class A • EN/BS EN 50121-3-2 Conducted & Radiated: Class A • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A • EN/BS EN61000-3-3 Voltage fluctuations & flicker • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A |
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EMS | • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV • EN/IEC 61000-4-5 Surges: AC Power: 2 kV • EN/IEC 61000-4-6 CS: 10V • EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz |
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Safety | LVD IEC/EN 62368-1 |